Accordion heat sink
US11776872B2 · kind B2 · utility
0Cited by
5References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 12, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Feb 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink includes a first flange, a second flange, and an accordion-shaped medial portion continuous between the first flange and the second flange. The first flange and the second flange are configured to be attached to a circuit board. The accordion-shaped medial portion includes troughs on a proximal side of the accordion-shaped medial portion and crests on a distal side of the accordion-shaped medial portion such that the heat sink is configured to disperse heat away from the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.