Patent · US Active

Cooling in a waveguide arrangement

US11777188B2 · kind B2 · utility

0Cited by

6References

15Claims

0Family size

Assignee

Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

Anatoli Deleniv · Mölndal, SE
Per Ingelhag · Alingsås, SE
Peter Melin · Lindome, SE

Key dates

Filing date	Jan 11, 2019
Grant date	Oct 3, 2023
Priority date	—
Expiry date	Jun 27, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01Q21/064
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

The present disclosure relates to a waveguide arrangement including a mounting printed circuit board, PCB, and at least a first waveguide layer. Each waveguide layer comprises at least a first waveguide conducting tube, each waveguide conducting tube having an electrically conducting inner wall. The PCB includes a signal interface for each waveguide conducting tube. The waveguide arrangement further includes at least a first coupling layer that is positioned between the PCB and the first waveguide conducting tube such that at least the first waveguide conducting tube of the first waveguide layer is connected to the corresponding signal interface via the first coupling layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.