Patent · US Active

Header for a package including an electronic component for radio frequency signal transmission

US11777189B2 · kind B2 · utility

1Cited by

2References

23Claims

0Family size

Assignee

Schott AG · DE

Inventors

Karsten Drögemüller · Eichenau, DE
Artit Aowudomsuk · Bangkok, TH

Key dates

Filing date	Apr 14, 2022
Grant date	Oct 3, 2023
Priority date	—
Expiry date	Apr 14, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/12
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A header, with improved cooling for electronic components for radio frequency signal transmission, for an electronic component for radio frequency data transfer, includes: a metallic base body including a plurality of electrical feedthroughs; a thermoelectric cooling element having one side bearing on the base body and an opposite side for mounting the electronic component; a radio frequency line to the electronic component being on the side for mounting the electronic component, with a ground conductor that is electrically connected to the metallic base body, the electrical connection to the metallic base body including a telluride element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.