Impedance matching method for low-profile ultra-wideband array antenna
US11777211B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jun 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q5/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An impedance matching method for a low-profile ultra-wideband array antenna is provided. The method includes: connecting an arm of a balanced end of a hyperbolic microstrip balun in series with an open circuit line; directly coupling the open circuit line to a radiator layer; connecting another arm of the balanced end of the hyperbolic microstrip balun to the radiator layer via a metallized via hole, and welding an unbalanced end of the hyperbolic microstrip balun to a coaxial line, so that the coaxial line feeds a power to the antenna via the hyperbolic microstrip balun. In this method, the open circuit line is integrated between the hyperbolic microstrip balun and the radiator layer of the antenna to achieve an impedance matching of the ultra-wideband antenna and to simplify a structure of a matching circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.