Bonded substrate, surface acoustic wave element, surface acoustic wave element device, and bonded substrate manufacturing method
US11777469B2 · kind B2 · utility
0Cited by
8References
19Claims
0Family size
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Key dates
| Filing date | Jun 7, 2018 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Aug 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/706
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A bonded substrate includes a quartz substrate and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded by covalently coupling at a bonding interface, and an orientation of the quartz substrate and an orientation of the piezoelectric substrate intersect with each other on an orthogonal direction side or in the range of 65 degrees to 115 degrees in a bonding surface direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.