Printed circuit board and wireless communication terminal
US11778730B1 · kind B1 · utility
0Cited by
21References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2023 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | May 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a dielectric substrate which is formed in a plate-like shape, ground conductor layers which are respectively provided on a top surface and a back surface of the dielectric substrate, a signal line which is provided on a side surface of the dielectric substrate, and transmits a high frequency signal, and a plurality of connection conductors which are provided in the dielectric substrate, connects the ground conductor layer provided on the top surface and the ground conductor layer provided on the back surface, and are aligned and disposed along the signal line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.