Patent · US Active

UV fixing glue for assembly

US11778753B2 · kind B2 · utility

0Cited by

6References

6Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Ilias Nikolaidis · Frankfurt am Main, DE
Alexander Zimmermann · Aachen, DE
Thomas Lauinger · Niedernberg, DE

Key dates

Filing date	Aug 27, 2020
Grant date	Oct 3, 2023
Priority date	—
Expiry date	Jul 17, 2041

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

One aspect relates to a method of manufacture of an electronic assembly comprising at least these steps: providing a substrate having at least a first contact area; positioning a spot of a UV curable substance on the substrate; positioning an electrically conductive item on the substrate wherein the electrically conductive item is superimposed on the first contact area and on the spot of curable substance; exposing the UV curable substance to UV irradiation, wherein a mechanical connection between the electrically conductive item and substrate is formed; and optionally connecting the first contact area with the electrically conductive item. One aspect relates to an electronic assembly comprising a substrate with a contact area, a spot of a cured substance on the substrate and an electrically conductive item that is in electrically conductive connection with the first contact area and mechanically connected through the spot of cured substance to the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.