Heat dissipation device with communication function
US11778784B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Sep 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q5/385
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device with a function of communication includes a conductive substrate, a first conductive sidewall, a second conductive sidewall, a plurality of heat sink elements, and a feeding element. The heat sink elements have different lengths, and they are positioned between the first conductive sidewall and the second conductive sidewall. The first conductive sidewall, the heat sink elements, and the second conductive sidewall are respectively coupled to the conductive substrate. The feeding element is coupled to a signal source. An antenna structure is formed by the feeding element, the conductive substrate, and the heat sink elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.