Fluid cooling system
US11778790B2 · kind B2 · utility
4Cited by
47References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2022 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Mar 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20518
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.