Composition of hot-melt adhesive film and method for producing shoe sole
US11779079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2019 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Feb 26, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a composition of a hot-melt adhesive film and a method for producing a shoe sole. The composition of the hot-melt adhesive film comprises a hot-melt adhesive material and an electromagnetic radiation absorbing material. The hot-melt adhesive material includes ethylene vinyl acetate and thermoplastic materials. The electromagnetic radiation absorbing material is uniformly dispersed in the hot-melt adhesive material. Energy of an electromagnetic radiation can be absorbed by the electromagnetic radiation absorbing material, thereby producing thermal energy, further increasing temperature and adhering property of the hot-melt adhesive film. Therefore, a midsole and an outsole of the shoe sole can be adhered by the hot-melt adhesive film. Further, the hot-melt adhesive film is made from recyclable materials. Therefore, the hot-melt adhesive film is fully recyclable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.