Systems, methods and apparatus for dispensing fluid to an object
US11779940B1 · kind B1 · utility
2Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2020 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Apr 9, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2697
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems, methods and apparatus related to pre-wetting an edge portion of a bonded wafer prior to wetting a flat, horizontal portion of the bonded wafer. The apparatus includes a frame having nozzles directed such that couplant discharged from these nozzles wet the edge of the wafer. The edge nozzles have couplant flow vectors that interface to dampen the trajectory of fluid to reduce splash and pre-wet the edges of the bonded wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.