Multiple laser beam processing
US11780027B2 · kind B2 · utility
1Cited by
40References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2019 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Jun 21, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/705
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Described herein is a system for processing a workpiece that includes a plurality of lasers that each produces a laser beam pulse. The system also includes a laser control module that sequences temporal characteristics of the laser beam pulses. Additionally, the system includes a laser beam compensation module that shapes a near field intensity profile of at least one of the laser beam pulses and adjusts a path length of at least one of the laser beam pulses. The system also includes at least one laser beam position element that combines the laser beam pulses to produce a combined laser beam pulse at a surface of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.