Method and apparatus for substrate stripping
US11780108B2 · kind B2 · utility
0Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2021 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Mar 26, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB31B2110/35
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for stripping away portions of substrate are disclosed herein. In some embodiments, a flexible and/or soft impact-element(s) rotates around a rotation axis to drive a peripheral portion across a substrate plane of the substrate and/or to repeatedly collide with the substrate. At least some of the collisions are effective to partially dislodge or to strip away portion(s) of substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.