Self rising board molding
US11780177B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2020 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Apr 16, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/771
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A three-dimensional component is produced in a simplified molding operation. Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. Boards can be formed by laminating two or more blanks together and/or by laminating the blanks with other materials, including non-expendable materials. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. In addition, the boards or blanks may be cut to create desired shapes of parts that can be placed in the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.