Polyamide hot-melt resin granules loaded with active ingredients
US11781014B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2021 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Sep 7, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J177/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.