One-component thermosetting epoxy adhesive with improved adhesion
US11781048B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2020 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Sep 1, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A of formula (II) wherein substituents R′ and R″ independently of one another are H or CH3 and index s has value of 0-12, fraction of epoxy resin A being from 20-70 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive; and b) at least one epoxy novolac EN of formula where R2= or CH2, R1=H or methyl and z=0-7, fraction of epoxy novolac EN being from 1-8 wt.-% based on total weight of one-component thermosetting epoxy resin adhesive; and c) at least one latent hardener B for epoxy resins; and d) at least one accelerator C for epoxy resins; and e) at least at least one toughness improver D, fraction of toughness improver D being from 5-40 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.