Aqueous dispersion of a silicone pressure sensitive adhesive base and methods for preparation and use of the dispersion
US11781050B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 21, 2021 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Jul 21, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An aqueous dispersion of a silicone pressure sensitive adhesive base can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive. The aqueous dispersion of the silicone pressure sensitive adhesive base includes a bis-hydroxyl-terminated polydiorganosiloxane; a polyorganosilicate resin; cumene; a surfactant; and water. A curing agent such as a peroxide compound or an aminosilane may be combined with the aqueous disperison of the silicone pressure sensitive adhesive base to form a silicone pressure sensitive adhesive composition. A pressure sensitive adhesive article may be formed by a method including coating a surface of a substrate with the silicone pressure sensitive adhesive composition, removing water, and curing the silicon pressure sensitive adhesive composition to form a silicone pressure sensitive adhesive on the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.