Panel for forming a floor covering, method for manufacturing such panels and granulate applied herewith
US11781326B2 · kind B2 · utility
2Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2022 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Feb 10, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24868
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A panel for forming a floor covering has a substrate including at least a layer of thermoplastic material, where the panel, above the layer, has at least also a printed décor and a translucent or transparent wear layer. The layer also includes at least individual fibers having a length greater than 1 millimeter, where the individual fibers are loose and freely distributed with the layer of thermoplastic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.