Lightweight structurally and thermally efficient oscillating heat pipe panel
US11781815B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2020 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Aug 23, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/0021
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.