Vibration sensor with pressure enhancement
US11781901B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2021 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Apr 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R31/003
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A vibration sensor includes a support board, a circuit board housing, a metal housing, a pressure-enhancing member and a sensor. The circuit board housing is located on a surface of the support board, and defines a first hollow chamber together with the support board. The metal housing is located on another surface of the support board, and defines a second hollow chamber together with the support board. The pressure-enhancing member is in one of the first and second hollow chambers. The sensor is in the other one of the first and second hollow chambers. The support board has a first through hole and a second through hole. The first through hole is misaligned with the pressure-enhancing member and the sensor. The second through hole is aligned between the pressure-enhancing member and the sensor. The sensor, support board and diaphragm collectively define a third hollow chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.