Thermal management system for electronic device
US11782281B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2021 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Jul 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20963
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.