Value added substrate interleaving system
US11782422B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 27, 2020 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Jul 14, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B2210/04
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A system for interleaving substrate under food products is provided. The system includes an interleaver assembly configured to interleave substrate with food products. A programmable logic controller (PLC) includes a sensor in communication with the interleaver assembly. The sensor is configured to detect an identifier provided on each substrate stock of a plurality of substrate stocks, and each identifier is associated with an interleaving profile. The interleaver assembly interleaves the substrate with the food product according to a specific interleaving profile in response to the sensor detecting the identifier on the substrate stock.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.