Molded substrates
US11784072B2 · kind B2 · utility
0Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2019 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Nov 19, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1637
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.