Interposer-type component carrier and method of manufacturing the same
US11784132B2 · kind B2 · utility
0Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2021 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Jul 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10522
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.