Semiconductor chip, semiconductor device, and semiconductor package including the semiconductor chip
US11784168B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2022 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | May 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06589
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip including a semiconductor substrate having a first surface and a second surface and having an active layer in a region adjacent to the first surface, a first through electrode penetrating at least a portion of the semiconductor substrate and connected to the active layer, a second through electrode located at a greater radial location from the center of the semiconductor substrate than the first through electrode, penetrating at least a portion of the semiconductor substrate, and connected to the active layer. The semiconductor chip also including a first chip connection pad having a first height and a first width, located on the second surface of the semiconductor substrate, and connected to the first through electrode, and a second chip connection pad having a second height greater than the first height and a second width greater than the first width, located on the second surface of the semiconductor substrate, and connected to the second through electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.