Semiconductor device and semiconductor module
US11784246B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 25, 2021 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Apr 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/511
Abstract
According to one embodiment, a semiconductor device includes first to fourth electrodes, a semiconductor member, and first and second insulating members. The semiconductor member is located between the second and first electrodes, and includes a first semiconductor region a second semiconductor region between the first semiconductor region and the first electrode, a third semiconductor region between the second semiconductor region and the first electrode, a fourth semiconductor region between the second semiconductor region and the first electrode, a fifth semiconductor region between the first semiconductor region and the second electrode, a sixth semiconductor region between the fifth semiconductor region and the second electrode, and a seventh semiconductor region between the fifth semiconductor region and the second electrode. A portion of the first insulating member is between the third electrode and the semiconductor member. A portion of the second insulating member is between the fourth electrode and the semiconductor member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.