Housing assembly, method for manufacturing housing assembly, and electronic device
US11785124B2 · kind B2 · utility
0Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2020 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Oct 28, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A housing assembly, a method for manufacturing the housing assembly, and an electronic device are provided according to the present disclosure. The housing assembly includes a housing body and a flexible film layer. The housing body has a bottom portion and at least one side wall connected with an outer edge of the bottom portion, and each of the at least one side wall and the bottom portion cooperatively define a bending angle larger than 70 degrees. The flexible film layer is disposed on a first surface of the housing body, and the flexible film layer has an elongation at break higher than or equal to 150%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.