High-voltage junction box coolant baffle
US11785740B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2021 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Nov 19, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60K2001/0438
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module is provided with a housing with a base and walls extending transversely from the base. The housing comprises an inlet port and an outlet port formed through the walls. A circuit board assembly is supported by the housing and includes electronics that generate heat during operation. A cold plate is mounted to the walls of the housing to define a manifold. The housing and the cold plate are in thermal communication with the circuit board assembly for transferring heat generated by the electronics. A baffle is disposed within the manifold for directing coolant flow. Elastic material is disposed over a distal end of the baffle and adapted to engage a lower surface of the cold plate in an interference fit to block coolant leakage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.