Temperature control of closely packed electronic assemblies
US11785743B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2021 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Aug 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin, single-layer thermally conductive jacket surrounds a PCA. One or more living springs integrated in the jacket exert compressive force on PCA components where cooling is desired. The compressive force creates and maintains a thermal contact though which heat is conducted out of the PCA components and into the jacket. The jacket conducts the heat (either directly or indirectly) to a liquid-cooled cold plate configured as a cooling frame surrounding one or more of the jacketed PCAs. The jacket, optionally through intermediate thermal transfer devices such as heat spreaders or heat pipes, transfers heat from components on the PCA to the cooling frame. Liquid flowing through the cooling frame's internal channels convects the heat out of the electronic device. Turbulence encouraged by turbulence enhancing artifacts including bends and shape-changes along the internal channels increases the efficiency of the convection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.