Implantable sensor electronics packaging

US11786125B2 · kind B2 · utility

Assignees

• DePuy Synthes Products, Inc. · US
• STITCHTING IMEC NEDERLAND · NL
• IMEC VZW · BE

Inventors

• George Mikhail · West Chester, US
• Binh Bao Vu · Bristol, US
• Jochen Walser · Zuchwil, CH
• Dan F. Dlugos · Sharonville, US
• Mark FICHMAN · Eindhoven, NL
• Seulki Lee · Elkridge, US
• Navid Shahriari · Chandler, US
• Erfan Sheikhi · Eindhoven, NL
• Maria Op de Beeck · Kasai, JP

Key dates

• Filing date: Dec 15, 2020
• Grant date: Oct 17, 2023
• Expiry date: Dec 3, 2041

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61B2090/064
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the sensor volume external to the enclosure.