Sensor film for endoscopic instruments
US11786264B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2020 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Dec 4, 2041 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/227
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method for sensing at least one property with an instrument, wherein the instrument comprises an elongate shaft body; the method comprising the steps of: securing a sensor film conformally to the elongate shaft body, the sensor film comprising: at least one substrate core having a first surface and a second surface; at least one sensing element; a first conductive layer residing on the first surface, the first conductive layer having first solder mask coated thereon, and wherein the first conductive layer is grounded; a second conductive layer residing on the second surface, the second conductive layer having a second solder mask coated thereon, and coupled to the at least one sensing element; causing the at least one sensing element to measure at least one property and output a sensed signal and to convey the sensed signal via the second conductive layer to an electronics module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.