Laser etching apparatus and laser etching method using the same
US11786990B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
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Key dates
| Filing date | Jan 20, 2020 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Nov 3, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser etching apparatus includes a light source to emit a first laser beam having a first energy profile; and a scanner to radiate a second laser beam upon an object along a circular path, the second laser beam having a second energy profile different from the first energy profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.