Method for grinding a surface of a workpiece and device therefore
US11787010B2 · kind B2 · utility
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8Claims
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Assignee
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Key dates
| Filing date | Jul 21, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Nov 10, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T7/001
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Grinding a surface of a workpieces is accomplished with a grinding machine having at least two grinding units. First, a target structure of the surface to be achieved is provided. Then, using predetermined grinding parameters, a first of the two grinding units is used to grind the surface of the structure. Then, the surface of the actual structure is captured and compared to the target structure. Based on the comparison, the grinding parameters are adjusted and the surface is then ground, using the adjusted parameters, with the second of the two grinding units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.