Bonding system and bonding method
US11787126B2 · kind B2 · utility
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5References
14Claims
0Family size
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Key dates
| Filing date | Mar 23, 2018 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Aug 24, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/30
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.