MEMS assembly substrates including a bond layer
US11787690B1 · kind B1 · utility
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20Claims
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Key dates
| Filing date | Apr 2, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Apr 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a micro electro mechanical system (MEMS) assembly comprises providing a substrate having an electrically conductive layer disposed thereon. The method also comprises depositing, on the substrate over the electrically conductive layer, a bonding material having an elastic modulus of less than 500 MPa so as to form a bond layer. The bond layer is completely cured, and a MEMS die is attached to the completely cured bond layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.