Activating surfaces for subsequent bonding
US11787911B2 · kind B2 · utility
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3References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 25, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Feb 25, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2481/008
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of activating a surface of a plastics substrate formed from: Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.