Filler, preparation method thereof, resin composition comprising the filler and article made therefrom
US11787935B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Dec 24, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/28
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A filler includes a first precursor and a second precursor; the first precursor is a hollow filler with a surface covered by a first silane coupling agent; the second precursor is a non-hollow filler with a surface covered by a second silane coupling agent; the first precursor and the second precursor are connected by a covalent bond formed by a chemical reaction between the first silane coupling agent and the second silane coupling agent. Also included are a preparation method of the filler and a resin composition containing the filler. A prepreg, a resin film, a laminate, or a printed circuit board made from the resin composition has excellent thermal resistance after moisture absorption, low Df variation rate under moisture and heat, low water absorption rate, high copper foil peeling strength, the prepreg having a smooth appearance and even color, and absence of branch-like pattern on laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.