Composed element, multi-layered board and panel-shaped element for forming this composed element
US11788568B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Jun 26, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31982
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
Composed element, wherein this composed element comprises at least two panel-shaped elements, which substantially are formed from a board material; wherein said panel-shaped elements are interconnected at an angle by means of coupling devices including a tongue and a groove, which coupling devices substantially are made as profiled parts in the board material; and wherein said coupling devices also include locking elements, which, in coupled condition, prevent the moving apart of the tongue and groove. The panel-shaped elements are formed on the basis of board material in the form of particle board consisting of two or more layers, which in respect to the average fineness of the particles, show a different degree of fineness, namely a basic layer with coarser particles, more particularly chips, and at least one outer layer, or at least a more outward-situated layer, which is of a finer composition than the composition of the basic layer, in other words, with particles, chips, respectively, which on average are finer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.