Optical and thermal interface for photonic integrated circuits
US11789219B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Oct 16, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.