Electronic device
US11789504B2 · kind B2 · utility
0Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Oct 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.