Heat sinking layer between a substrate and encasing layers of a recording head
US11790939B1 · kind B1 · utility
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18References
20Claims
0Family size
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Key dates
| Filing date | Jan 3, 2022 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | May 22, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A recording head includes one or more transducer elements, and an electrically insulative layer encasing the one or more transducer elements. The recording head also includes a substrate below the electrically insulative layer. The recording head further includes a heat sinking layer between the electrically insulative layer and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.