Semiconductor module
US11791236B2 · kind B2 · utility
0Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Jul 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module may include a first PCB, at least one first semiconductor chip, a heat sink and at least one first TEC. The at least one semiconductor chip is on the first PCB. The heat sink may be configured to surround the first PCB and the at least one semiconductor control chip. The first TEC may be on the first PCB to cool heat from the first PCB. Thus, performances of the semiconductor module may not be deteriorated by the heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.