Electrically power assembly with thick electrically conductive layers
US11791254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2020 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Oct 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0323
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical power assembly, comprising: at least one multilayer base structure, at least one power device embedded in the at least one multilayer base structure, an internal electrically conductive layer positioned on each side of the multilayer base structure, the internal electrically conductive layer being connected to a respective electrical contact of the power device through connections arranged in the multilayer base structure; at least one external electrically conductive layers positioned on each side of the base structure, each external electrically conductive layer comprising at least one pre-drilled through hole, at least one internal electrically insulating layer positioned between the internal electrically conductive layer of the base structure and a respective external electrically conductive layer, at least one hole arranged in the internal electrically insulating layer and the external electrically conductive layer, a portion of each hole being formed by the pre-drilled through hole, the at least one hole being filled with electrically conductive material to form external conductive vias to connect the internal electrically conductive layer to the respective exte…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.