Patent · US Active

Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects

US11791274B2 · kind B2 · utility

0Cited by

13References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Manish Dubey · Chandler, US
Omkar G. Karhade · Chandler, US
Nitin A. Deshpande · Chandler, US
Jinhe Liu · Chandler, US
Sairam Agraharam · Chandler, US
Mohit Bhatia · Chandler, US
Edvin Cetegen · Chandler, US

Key dates

Filing date	Jun 16, 2020
Grant date	Oct 17, 2023
Priority date	—
Expiry date	Nov 7, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.