Methods of recycling silicon swarf into electronic grade polysilicon or metallurgical-grade silicon
US11791435B2 · kind B2 · utility
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Key dates
| Filing date | Dec 27, 2022 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Dec 27, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods of recycling silicon swarf into electronic grade polysilicon or metallurgical-grade silicon are described herein are described. In an example, a method includes cutting a silicon ingot and recovering silicon swarf having a first purity from the cutting process. The recovered silicon is purified in an upgraded metallurgical silicon process to produce electronic grade polysilicon particles having a second purity higher than the first purity. The upgraded metallurgical silicon process can include dissolving the recovered silicon particles in a molten aluminum metal smelt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.