Forming connections to flexible interconnect circuits
US11791577B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Feb 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10401
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor-joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.