High speed, high density connector
US11791585B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Feb 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6582
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Electrical connectors for very high speed signals, including signals at frequencies at or above 112 GHz, with high density. Such connectors may be formed with fine features molded into portions of the connector housing to support closely spaced signal conductors. The signal conducts may nonetheless be accurately positioned, which leads to uniform impedance and other electrical characteristics that enable high frequency operation through the use of skeletal members that restrain bowing and twisting of housing components that position, directly or indirectly, the signal conductors. The skeletal members may be simply incorporated into the housing components by stamping a metal skeleton from a metal sheet in conjunction with one or more carrier strips. The housing component may be overmolded around the skeleton and then severed from the carrier strips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.