Modular electronic building systems and methods of using the same
US11791589B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2018 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Jun 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/2442
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In some embodiments, an apparatus includes a first connector including a first housing portion having top and bottom surfaces and a second connector including a second housing portion having top and bottom surfaces. The second housing portion has a form factor substantially corresponding to a form factor of the first housing portion. A circuit board having top and bottom surfaces is permanently coupled to the first housing portion and to the second housing portion such that a first portion of the bottom surface of the circuit board contacts at least a portion of the top surface of the first housing portion and a second portion of the bottom surface of the circuit board contacts at least a portion of the top surface of the second housing portion. A contact assembly is coupled to the first housing portion and electrically and directly engages a portion of the bottom surface of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.