Mitigation of physical impact-induced mechanical stress damage to printed circuit boards
US11792913B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2022 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Oct 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This document describes techniques and apparatuses directed to the mitigation of physical impact-induced mechanical stress damage to printed circuit boards through the utilization of a conductive shield track having a varied width (dynamic width). In an aspect, disclosed is a device that includes a printed circuit board, an electrical component on the printed circuit board in a shielded area, a conductive shield track on the printed circuit board, a component shield having a sidewall and a sidewall base, and solder disposed between the sidewall base and the conductive shield track to couple the component shield to the ground plane of the PCB to form a shielded compartment over the shielded area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.