Electronic module and electronic apparatus
US11792917B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2022 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | May 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.